Mfg Part Number: UPD2167 | Manufacturer: Nec Electronics Usa Inc | NSN : 5962-01-267-8169 |
Item Name : microcircuit memory | CAGE Code : 4T165 | FSC : 5962 Microcircuits Electronic |
At Alpha Purchasing, we help you procure high-quality components associated with the NSN 5962-01-267-8169, and many others. Microcircuit Memory is manufactured by Nec Electronics Usa Inc, and is listed with the part number UPD2167. This item, along with any other component listed on our website, is readily available for immediate purchase today, and we invite you to begin the purchasing process with the submission of an RFQ form for part number UPD2167. When completing the form, we ask that you include as much detail as possible so that our account managers may craft a quote that accurately reflects your individual requirements. Our team of experts is always available for our customers, and responses will be returned within 15 minutes of submission.
We invite you to explore our robust NSN parts catalog at Alpha Purchasing today. A National Stock Number (NSN) is a 13-digit numeric code assigned to material items in the federal supply chain. This convenient classification system is used by government and military entities worldwide. For your convenience, we list every NSN component with several identifiers, including CAGE codes. For example, the CAGE code associated with Nec Electronics Usa Inc is 4T165. Submit an RFQ today for part number UPD2167 with 5962-01-267-8169 or any other NSN part and experience a streamlined purchasing platform.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-267-8169 Item Description: Microcircuit Memory | 5962 | 012678169 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Upd2167 | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.065 INCHES NOMINAL |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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